Ultratech Secures Repeat Advanced Packaging (AP) Order

Ultratech Secures Repeat AP Order Win With OSAT Customer

Major Asian OSAT (outsourced semiconductor assembly and test) Company Orders Ultratech AP300W for High-volume Advanced Packaging Applications

SAN JOSE, Calif., July 2, 2013 /PRNewswire/ -- Ultratech, Inc. ( My UTEK Charts), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs) announced that it has received a repeat order from a leading outsourced semiconductor assembly and test (OSAT) company in Asia. The AP300W lithography system built on Ultratech's customizable Unity Platform™ will be utilized for wafer-level packaging (WLP) applications to support growth driven by communication devices. As the advanced packaging technology requirements evolve, OSATs will play an important role in establishing the supply chain. This major win further confirms Ultratech's ability to deliver operational flexibility, technology leadership and highest economic value for its customers.

"Demand for thinner mobile communication devices such as smartphones and tablets are driving much of the growth in WLP," according to Jan Vardaman, president and founder of TechSearch International. "Many of the suppliers of the integrated circuits used in these products depend on OSATs to meet their production needs. It is expected that the OSAT expansion will continue over the next several years to address this growth opportunity."

Ultratech Vice President, Advanced Packaging Technology/Nanotechnology Market Manish Ranjan said, "Ultratech has maintained a leading market position over the last decade by delivering outstanding production performance with superior cost-of-ownership solutions. We look forward to working closely with our customers in the OSAT segment to support their high-volume production ramps."

Certain of the statements contained herein..... http://seekingalpha.com/news-article/6982112-ultratech-secures-repeat-ap-order-win-with-osat-customer

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Ultratech to Share DOE Grant for Solid State Lighting

Ultratech Inc, (UTEK charts) will share a $23.5M Department of Energy (DOE) grant with Applied Materials (AMAT Charts), GE Global Research (GE Charts), GE Lumination, KLA-Tencor Corporation (KLAC), Philips Lumileds Lighting Company, Universal Display Corporation (UDC) and Veeco Instruments as part of the American Recovery and Reinvestment Act to support manufacturing high-efficiency solid-state lighting projects.

"Low-Cost Lithography Tool for High-Brightness LED Manufacturing"

Ultratech, with team member SemiLEDs, will attempt to develop a lithographic manufacturing tool with the benefits of higher throughput, greater yields, lower initial capital cost, and lower cost of ownership. Ultratech will modify a projection stepper process used for larger wafers and optimize it for LED manufacturing. The proposed new manufacturing tool will be able to accommodate a variety of wafer sizes and thicknesses and handle the wafer warpage typically associated with larger-diameter wafers.

From DOE Announces Selections for SSL Core Technology (Round 6), Product Development (Round 6), and U.S. Manufacturing (Round 1) Funding Opportunities

These eight selections

"are focused on achieving significant cost reductions and enhancing quality through improvements in manufacturing equipment, processes, or monitoring techniques. Projects address the technical challenges that must be overcome before prices fall to a level where solid-state lighting will be competitive with existing lighting on a first-cost basis. The total value of manufacturing selections is $23.5 million; the performers will provide an average of 51 percent as cost-share.

A major DOE objective in funding these projects is to develop, establish, and/or maintain the solid-state lighting technology and manufacturing base within the U.S., which will create jobs and promote our nation's role as a leader in the field. "

Ultratech has said during conference calls it now sells a new, low cost (under $1M) solder bump stepper for small wafers (probably between 1 and 3 inches) used for white LEDs that will replace incandescent and fluorescent lights. Ultratech said it expects this market for efficient visible LEDs to grow 35% per year starting in 2010.

To get costs down, manufactures will want to use larger wafers similar to how microprocessors and other silicon based semiconductors grew from 3-inches in diameter 30 years ago to 12 inches today.

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